US 12,326,662 B2
Method for manufacturing microstructure including cured products of photosensitive resin compositions
Yohei Hamade, Tokyo (JP); Kazunari Ishizuka, Shizuoka (JP); Satoshi Tsutsui, Kanagawa (JP); Miho Ishii, Kanagawa (JP); Haruka Yamaji, Tokyo (JP); and Hikaru Sugimoto, Kanagawa (JP)
Assigned to Canon Kabushiki Kaisha, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Oct. 19, 2022, as Appl. No. 18/047,688.
Claims priority of application No. 2021-176486 (JP), filed on Oct. 28, 2021.
Prior Publication US 2023/0144597 A1, May 11, 2023
Int. Cl. B41J 2/14 (2006.01); B41J 2/16 (2006.01); G03F 7/038 (2006.01); G03F 7/039 (2006.01); G03F 7/095 (2006.01)
CPC G03F 7/095 (2013.01) [B41J 2/1433 (2013.01); B41J 2/162 (2013.01); B41J 2/1631 (2013.01); G03F 7/0385 (2013.01); G03F 7/039 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A method for manufacturing a microstructure comprising cured products of photosensitive resin compositions, the method comprising:
a step of forming at least two layers of the photosensitive resin compositions each comprising a photopolymerization initiator;
a step of subjecting each of the formed at least two layers of the photosensitive resin compositions to patterning exposure; and
a step of collectively developing the exposed at least two layers of the photosensitive resin compositions to obtain a microstructure,
wherein in the at least two layers of the photosensitive resin compositions, 90% by mass or more of photopolymerization initiator content in at least one of two adjacent layers of the photosensitive resin compositions is a nonionic photopolymerization initiator.