US 12,326,463 B2
Probe card needle shape and method of manufacturing
Ting-Yu Chiu, Hsinchu (TW); Yi-Neng Chang, Hsinchu (TW); Wen-Chun Tu, Hsinchu (TW); Te-Kun Lin, Hsinchu (TW); and Chien Fang Huang, Hsinchu (TW)
Assigned to Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Feb. 7, 2023, as Appl. No. 18/165,863.
Claims priority of provisional application 63/382,473, filed on Nov. 4, 2022.
Prior Publication US 2024/0151743 A1, May 9, 2024
Int. Cl. G01R 1/067 (2006.01); C25D 5/08 (2006.01); C25D 7/00 (2006.01)
CPC G01R 1/0675 (2013.01) [C25D 5/08 (2013.01); C25D 7/00 (2013.01); G01R 1/06738 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method, comprising:
inserting respective tips of a plurality of conductive bodies of a probe card through an opening of a tank into an electrolytic fluid in a reservoir of the tank;
aligning the respective tips of the plurality of conductive bodies with corresponding ones of a plurality of recesses in a conductive pattern structure;
forming a plurality of needles including:
removing first portions from the plurality of conductive bodies at the respective tips of the plurality of conductive bodies by applying an electrical signal to the electrolytic fluid initiating a flow of electrons in the electrolytic fluid between the conductive pattern structure and the respective tips of the plurality of conductive bodies, and by activating a pump initiating a flow of the electrolytic fluid between the conductive pattern structure and the respective tips of the plurality of conductive bodies; and
removing the plurality of needles from the electrolytic fluid.