US 12,326,462 B2
Probe head and probe assembly
Zhou Yi Lin, New Taipei (TW)
Assigned to AZOTH STUDIO LTD. CO., New Taipei (TW)
Filed by AZOTH STUDIO LTD. CO., New Taipei (TW)
Filed on Jul. 19, 2023, as Appl. No. 18/223,681.
Claims priority of application No. 111128543 (TW), filed on Jul. 29, 2022.
Prior Publication US 2024/0036073 A1, Feb. 1, 2024
Int. Cl. G01R 1/067 (2006.01)
CPC G01R 1/06738 (2013.01) [G01R 1/06722 (2013.01); G01R 1/06744 (2013.01); G01R 1/06755 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A probe head for electrical detection of semiconductor devices, comprising:
a probe head body, which includes a first body portion having a contact end face, a second body portion, and a third body portion sequentially stacked and coupled in a direction of a central axis; and
at least one contact portion in a shape of a polygon cone, which is coupled to the contact end face and disposed at a periphery of the contact end face, wherein each contact portion has an inclined edge with a length less than 650 microns or an inclined plane with an area less than 0.2 square millimeters facing the central axis,
wherein the inclined edge or inclined plane is inclined upward and outward from a portion close to the central axis, in order that when performing the electrical detection, the inclined edge or inclined plane contacts an object to be tested at a side portion of the object away from a central region thereof.