US 12,326,369 B2
Temperature sensing module and electronic device having the same
Cheng-Hun Yang, New Taipei (TW); and Hsin-Chun Huang, New Taipei (TW)
Assigned to CHICONY ELECTRONICS CO., LTD., New Taipei (TW)
Filed by Chicony Electronics Co., Ltd., New Taipei (TW)
Filed on Dec. 17, 2021, as Appl. No. 17/554,178.
Claims priority of application No. 11010859.4 (TW), filed on Mar. 10, 2021.
Prior Publication US 2022/0291046 A1, Sep. 15, 2022
Int. Cl. G01J 5/04 (2006.01); G01J 5/00 (2022.01); G01J 5/0806 (2022.01); G01J 5/0875 (2022.01)
CPC G01J 5/041 (2013.01) [G01J 5/0025 (2013.01); G01J 5/0806 (2013.01); G01J 5/0875 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A temperature sensing module comprising:
a hollow base, having a through hole, a first end, and a second end opposite the first end, wherein the first end has a first opening, the second end has a second opening, and the through hole is in communication between the first opening and the second opening;
an infrared temperature sensor disposed in the through hole and adjacent to the second opening, wherein the infrared temperature sensor comprises a photosensitive surface, and the photosensitive surface faces the first opening;
a condenser lens disposed in the through hole and adjacent to the first opening, wherein the condenser lens corresponds to the photosensitive surface of the infrared temperature sensor; and
a lens barrel, wherein the lens barrel is assembled on the first end of the hollow base, and the condenser lens is disposed in the lens barrel,
wherein an outer wall of the lens barrel and an inner wall of the through hole of the hollow base have male and female threading patterns, respectively, and the lens barrel is threaded with and fixed in the through hole of the hollow base.