US 12,326,250 B2
Thermally managed hazardous location LED light fixture, assembly and methods without utilizing heat sinks
Yang Yang, Shanghai (CN); Srinath K. Aanegola, Bengaluru (IN); and Peihuan Liu, Shanghai (CN)
Assigned to Eaton Intelligent Power Limited, Dublin (IE)
Filed by EATON INTELLIGENT POWER LIMITED, Dublin (IE)
Filed on Mar. 5, 2024, as Appl. No. 18/596,571.
Application 18/596,571 is a continuation of application No. 18/186,893, filed on Mar. 20, 2023, granted, now 12,066,177.
Application 18/186,893 is a continuation of application No. 17/136,961, filed on Dec. 29, 2020, granted, now 11,608,975, issued on Mar. 21, 2023.
Claims priority of application No. 201911411469.3 (CN), filed on Dec. 31, 2019.
Prior Publication US 2024/0210027 A1, Jun. 27, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. F21V 31/04 (2006.01); F21V 3/06 (2018.01); F21V 15/01 (2006.01); F21V 23/00 (2015.01); F21V 23/02 (2006.01); F21V 25/12 (2006.01); F21V 29/10 (2015.01); F21V 29/503 (2015.01); F21V 29/508 (2015.01); F21V 31/00 (2006.01); F21Y 103/10 (2016.01); F21Y 115/10 (2016.01); H05B 45/56 (2020.01)
CPC F21V 31/04 (2013.01) [F21V 3/062 (2018.02); F21V 15/01 (2013.01); F21V 23/003 (2013.01); F21V 23/009 (2013.01); F21V 23/02 (2013.01); F21V 25/12 (2013.01); F21V 29/10 (2015.01); F21V 29/503 (2015.01); F21V 29/508 (2015.01); F21V 31/005 (2013.01); H05B 45/56 (2020.01); F21Y 2103/10 (2016.08); F21Y 2115/10 (2016.08)] 20 Claims
OG exemplary drawing
 
1. A light fixture, comprising:
an axially elongated enclosure;
a first axially elongated printed circuit board with light emitting diode (LED) components mounted in the axially elongated enclosure;
a second axially elongated printed circuit board with LED components mounted in the axially elongated enclosure; and
an LED driver module mounted in the axially elongated enclosure and configured to operate both the first and second axially elongated printed circuit boards, wherein the LED driver module is (1) positioned laterally in the axially elongated enclosure at a location between the first axially elongated printed circuit board and the second axially elongated printed circuit board and between both ends of the first axially elongated printed circuit board, and (2) elevated in a vertical direction in the axially elongated enclosure relative to the first and second axially elongated printed circuit boards.