US 12,325,901 B2
AI wiring material
Yuto Kurihara, Saitama (JP); Ryo Oishi, Saitama (JP); Motoki Eto, Saitama (JP); Daizo Oda, Saitama (JP); Tetsuya Oyamada, Tokyo (JP); Yuya Suto, Tokyo (JP); and Tomohiro Uno, Tokyo (JP)
Assigned to NIPPON MICROMETAL CORPORATION, Saitama (JP); and NIPPON STEEL Chemical & Material Co., Ltd., Tokyo (JP)
Appl. No. 17/764,872
Filed by NIPPON MICROMETAL CORPORATION, Saitama (JP); and NIPPON STEEL Chemical & Material Co., Ltd., Tokyo (JP)
PCT Filed Sep. 17, 2020, PCT No. PCT/JP2020/035337
§ 371(c)(1), (2) Date Mar. 29, 2022,
PCT Pub. No. WO2021/065551, PCT Pub. Date Apr. 8, 2021.
Claims priority of application No. 2019-181187 (JP), filed on Oct. 1, 2019.
Prior Publication US 2022/0341004 A1, Oct. 27, 2022
Int. Cl. C22C 21/00 (2006.01); C21D 8/06 (2006.01); C22C 16/00 (2006.01); C22C 19/03 (2006.01); C22C 28/00 (2006.01)
CPC C22C 21/00 (2013.01) [C21D 8/06 (2013.01); C22C 16/00 (2013.01); C22C 19/03 (2013.01); C22C 28/00 (2013.01)] 8 Claims
 
1. An Al wiring material containing Sc, Zr, and Ni so as to satisfy
0.01≤x1≤0.5,
0.01≤x2≤0.3, and
10≤x3≤500
where x1 is a content of Sc [% by weight], x2 is a content of Zr [% by weight], and x3 is a content of Ni [ppm by weight],
with the balance comprising 99.8% by weight or more Al, and
wherein a tensile strength of the Al wiring material is 140 MPa or less.