| CPC B81B 7/02 (2013.01) [B81B 3/0051 (2013.01); B81C 2203/0109 (2013.01)] | 20 Claims |

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1. A microelectromechanical device, comprising:
a substrate;
a first structural layer on the substrate;
a second structural layer on the first structural layer;
a sensing mass in the first structural layer;
a plurality of first elastic connections coupled to the sensing mass and to the substrate, the sensing mass having a maximum displacement distance in a sensing direction perpendicular to the substrate via the plurality of first elastic connections;
an anchor coupled to the substrate;
a limit plate in the second structural layer facing the sensing mass;
a gap between the sensing mass and the limit plate, the gap having a width less than the maximum displacement distance of the sensing mass; and
at least one second elastic connection coupled to the limit plate and to the anchor.
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