US 12,325,236 B2
Substrate for liquid ejection head and method for manufacturing substrate for liquid ejection head
Masataka Kato, Kanagawa (JP)
Assigned to Canon Kabushiki Kaisha, Tokyo (JP)
Filed by CANON KABUSHIKI KAISHA, Tokyo (JP)
Filed on Mar. 23, 2023, as Appl. No. 18/188,575.
Claims priority of application No. 2022-056368 (JP), filed on Mar. 30, 2022.
Prior Publication US 2023/0311503 A1, Oct. 5, 2023
Int. Cl. B41J 2/14 (2006.01); B41J 2/16 (2006.01)
CPC B41J 2/14233 (2013.01) [B41J 2/161 (2013.01); B41J 2/1626 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A substrate for a liquid ejection head, comprising:
an ejection hole for ejecting a liquid from an inside to an outside of the substrate;
wherein a plurality of scallops are formed at an inner circumferential surface of the ejection hole, and the plurality of scallops periodically change a diameter of the inner circumferential surface in a penetration direction thereof,
wherein the plurality of scallops include a first scallop and a second scallop, a width in the penetration direction of the first scallop is narrower than a width in the penetration direction of the second scallop, and the first scallop is on a side closest to the outside, and the second scallop is adjacent to the first scallop on a side closer to the inside, and
wherein a depth in a radial direction of the ejection hole of the first scallop is shallower than a depth in the radial direction of the ejection hole of the second scallop.