US 12,325,101 B2
Polishing apparatus and polishing method
Masaki Kinoshita, Tokyo (JP); Takashi Kishi, Tokyo (JP); and Toshiki Miyakawa, Tokyo (JP)
Assigned to EBARA CORPORATION, Tokyo (JP)
Filed by EBARA CORPORATION, Tokyo (JP)
Filed on Dec. 21, 2022, as Appl. No. 18/086,200.
Claims priority of application No. 2021-213796 (JP), filed on Dec. 28, 2021.
Prior Publication US 2023/0201991 A1, Jun. 29, 2023
Int. Cl. B24B 37/04 (2012.01); B24B 37/20 (2012.01)
CPC B24B 37/042 (2013.01) [B24B 37/205 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A polishing apparatus comprising:
a polishing pad having a polishing surface;
a polishing head configured to press a workpiece against the polishing surface;
a transparent window disposed in the polishing pad;
a polishing table configured to support the polishing pad;
an optical sensor head located below the transparent window and configured to direct light to the workpiece through the transparent window and receive reflected light from the workpiece through the transparent window; and
a cooling device configured to cool a space between the transparent window and the optical sensor head.