US 12,325,053 B2
Substrate treating apparatus and substrate treating method
Jin Woo Jung, Cheonan-si (KR); Do Hyeon Yoon, Cheonan-si (KR); and Young Hun Lee, Cheonan-si (KR)
Assigned to Semes Co., Ltd., Chungcheongnam-do (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Mar. 23, 2022, as Appl. No. 17/702,127.
Claims priority of application No. 10-2021-0038599 (KR), filed on Mar. 25, 2021.
Prior Publication US 2022/0305530 A1, Sep. 29, 2022
Int. Cl. H01L 21/67 (2006.01); B08B 3/02 (2006.01); B08B 3/04 (2006.01); B08B 3/08 (2006.01); B08B 13/00 (2006.01)
CPC B08B 3/08 (2013.01) [B08B 3/022 (2013.01); B08B 3/041 (2013.01); B08B 13/00 (2013.01); H01L 21/67034 (2013.01)] 11 Claims
OG exemplary drawing
 
1. An apparatus for treating a substrate, the substrate treating apparatus comprising:
a liquid treating chamber configured to supply a treating liquid onto a substrate to liquid treat the substrate;
a drying chamber configured to remove the treating liquid from the substrate;
a transferer configured to transfer the substrate between the liquid treating chamber and the drying chamber; and
a controller configured to control the liquid treating chamber, the drying chamber, and the transferer,
the controller configured to control the liquid treated substrate to standby at the liquid treating chamber until the drying chamber becomes available for receiving the substrate from the liquid treating chamber, based on the liquid treated substrate at the liquid treating chamber being unable to be transferred to the drying chamber, and
the controller configured to control the treating liquid to be supplied to the substrate while the liquid treated substrate is standing by.