| CPC B05D 1/204 (2013.01) [H10K 71/10 (2023.02); H10K 85/324 (2023.02); H10K 85/40 (2023.02); H10K 85/701 (2023.02); H10K 2102/00 (2023.02)] | 15 Claims |

|
1. A process for depositing a film onto a substrate using a liquid composition, comprising the following steps:
a) formation of a film in the form of a bubble using the liquid composition,
b) placing the film in the form of a bubble in contact with the substrate, and
c) depositing the film in the form of a bubble on the substrate,
wherein the liquid composition comprises a neutral surfactant and a charged lamellar compound, in which the liquid composition is obtained by mixing the charged lamellar compound with the neutral surfactant and the concentration of neutral surfactant before mixing with the charged lamellar compound is less than 0.95 of the critical micelle concentration (CMC) of said surfactant.
|