US 12,324,701 B2
Intra-cardiac echocardiography interposer
Wojtek Sudol, Andover, MA (US); William John Ossmann, Acton, MA (US); and Stephen Davies, El Dorado Hills, CA (US)
Assigned to PHILIPS IMAGE GUIDED THERAPY CORPORATION, San Diego, CA (US)
Filed by PHILIPS IMAGE GUIDED THERAPY CORPORATION, San Diego, CA (US)
Filed on Aug. 30, 2022, as Appl. No. 17/898,951.
Application 17/898,951 is a continuation of application No. 16/338,820, granted, now 11,426,140, previously published as PCT/EP2017/075092, filed on Oct. 3, 2017.
Claims priority of provisional application 62/434,489, filed on Dec. 15, 2016.
Claims priority of provisional application 62/403,278, filed on Oct. 3, 2016.
Prior Publication US 2022/0409171 A1, Dec. 29, 2022
Int. Cl. A61B 8/12 (2006.01); A61B 8/00 (2006.01); A61B 8/08 (2006.01); B06B 1/02 (2006.01); B06B 1/06 (2006.01); H01L 23/00 (2006.01); H01L 25/16 (2023.01)
CPC A61B 8/12 (2013.01) [A61B 8/0883 (2013.01); A61B 8/0891 (2013.01); A61B 8/4444 (2013.01); A61B 8/4483 (2013.01); A61B 8/4494 (2013.01); B06B 1/0215 (2013.01); B06B 1/0292 (2013.01); B06B 1/0622 (2013.01); B06B 1/067 (2013.01); H01L 24/48 (2013.01); H01L 25/162 (2013.01); B06B 2201/76 (2013.01); H01L 2224/48157 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
an intraluminal imaging catheter comprising:
a diameter sized for advancement through a blood vessel of a patient;
an imaging component comprising an integrated circuit (IC) layer; and
an interposer configured to transmit an electrical signal associated with the imaging component,
wherein the imaging component and the interposer fit inside the diameter,
wherein the interposer comprises a multi-layered substrate structure,
wherein the IC layer is physically separate from the multi-layered substrate structure,
wherein the IC layer is positioned distal to the multi-layered substrate structure along a length of the intraluminal imaging catheter, and
wherein the multi-layered substrate structure comprises:
a top layer comprising a first contact pad and a second contact pad;
a base layer; and
an intermediate layer disposed between the top layer and the base layer, wherein the intermediate layer comprises a conductive line coupled to the first contact pad and the second contact pad such that the electrical signal is transmitted via the first contact pad, the conductive line, and the second contact pad.