US D1,029,985 S
Substrate
Paul E. Furner, Racine, WI (US); and Paul Diehl, New York, NY (US)
Assigned to S. C. JOHNSON & SON, INC., Racine, WI (US)
Filed by S. C. JOHNSON & SON, INC., Racine, WI (US)
Filed on Feb. 7, 2024, as Appl. No. 29/928,068.
Application 29/928,068 is a continuation of application No. 29/899,277, filed on Aug. 7, 2023, granted, now D1018767.
Application 29/899,277 is a continuation of application No. 29/826,110, filed on Feb. 9, 2022, granted, now D1010060, issued on Jan. 2, 2024.
Term of patent 15 Years
LOC (14) Cl. 22 - 06
U.S. Cl. D22—122
OG exemplary drawing
 
The ornamental design for a substrate, as shown and described.