US D1,029,806 S
Microphone windscreen
Yusuke Sano, Tokyo (JP)
Assigned to AUDIO-TECHNICA CORPORATION, Tokyo (JP)
Filed by Audio-Technica Corporation, Tokyo (JP)
Filed on Apr. 22, 2022, as Appl. No. 29/793,352.
Claims priority of application No. 2021-023175 (JP), filed on Oct. 25, 2021.
Term of patent 15 Years
LOC (14) Cl. 14 - 01
U.S. Cl. D14—225
OG exemplary drawing
 
The ornamental design for a microphone windscreen, as shown and described.