US D1,029,656 S
Belted cover for electronic device
Erika Yasuda, Tokyo (JP); Yuri Okamoto, Tokyo (JP); Tadanori Kanemura, Tokyo (JP); and Megumi Shiina, Tokyo (JP)
Assigned to BANDAI CO., LTD., Tokyo (JP)
Filed by BANDAI CO., LTD., Tokyo (JP)
Filed on Nov. 23, 2021, as Appl. No. 29/816,625.
Claims priority of application No. 2021-011479 D (JP), filed on May 28, 2021.
Term of patent 15 Years
LOC (14) Cl. 10 - 07
U.S. Cl. D10—30
OG exemplary drawing
 
The ornamental design for a belted cover for electronic device, as shown and described.