US 12,004,387 B2
Display substrate and manufacturing method thereof, and display device
Hongwei Ma, Beijing (CN); Xiangdan Dong, Beijing (CN); and Rui Wang, Beijing (CN)
Assigned to Chengdu BOE Optoelectronics Technology Co., Ltd., Sichuan (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
Appl. No. 16/975,521
Filed by Chengdu BOE Optoelectronics Technology Co., Ltd., Chengdu (CN); and BOE TECHNOLOGY GROUP CO., LTD., Beijing (CN)
PCT Filed Oct. 29, 2019, PCT No. PCT/CN2019/114061
§ 371(c)(1), (2) Date Aug. 25, 2020,
PCT Pub. No. WO2021/081765, PCT Pub. Date May 6, 2021.
Prior Publication US 2022/0384555 A1, Dec. 1, 2022
Int. Cl. H10K 59/131 (2023.01); H10K 59/121 (2023.01)
CPC H10K 59/131 (2023.02) [H10K 59/1213 (2023.02)] 18 Claims
OG exemplary drawing
 
1. A display substrate, comprising:
a base substrate, comprising a display region, a dam region at least partially surrounding the display region, a transition region on a side of the dam region away from the display region, a first bonding region on a side of the transition region away from the dam region, and a bonding peripheral region on the side of the transition region away from the dam region, wherein the bonding peripheral region is between the first bonding region and the transition region;
lead wires, in the first bonding region;
a plurality of contact pads, in the first bonding region and configured to be electrically connected to the lead wires, respectively;
a first insulation laminated layer, in the first bonding region;
a second insulation laminated layer, in the bonding peripheral region, wherein at least two insulation layers of the second insulation laminated layer extend into the first bonding region to obtain the first insulation laminated layer; and
a third insulation laminated layer, in the transition region, wherein the third insulation laminated layer comprises a first insulation laminated sub-layer and a second insulation laminated sub-layer, an orthographic projection of the first insulation laminated sub-layer on the base substrate at least partially covers the transition region and the bonding peripheral region, and an orthographic projection of the second insulation laminated sub-layer on the base substrate at least partially covers the transition region and the bonding peripheral region,
wherein a thickness of the first insulation laminated layer along a direction perpendicular to the base substrate is smaller than a thickness of the second insulation laminated layer along the direction perpendicular to the base substrate,
the third insulation laminated layer further comprises a third insulation laminated sub-layer that is between the first insulation laminated sub-layer and the second insulation laminated sub-layer, and
an orthographic projection of the third insulation laminated sub-layer on the base substrate does not overlap with the first bonding region and the bonding peripheral region.