US 12,004,368 B2
Display device including thin encapsulation layer containing silicon oxynitride layer
Juwon Lee, Asan-si (KR); Ojun Kwon, Hwaseong-si (KR); Ran Kim, Asan-si (KR); and Soonmi Choi, Cheonan-si (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Yongin-si (KR)
Filed by SAMSUNG DISPLAY CO., LTD., Yongin-si (KR)
Filed on Aug. 19, 2021, as Appl. No. 17/406,229.
Claims priority of application No. 10-2020-0172316 (KR), filed on Dec. 10, 2020.
Prior Publication US 2022/0190286 A1, Jun. 16, 2022
Int. Cl. H10K 50/84 (2023.01); H10K 50/844 (2023.01); H10K 59/12 (2023.01); G09G 3/3275 (2016.01); G09G 3/3283 (2016.01); G09G 3/3291 (2016.01); H10K 59/122 (2023.01); H10K 59/124 (2023.01); H10K 77/10 (2023.01); H10K 102/00 (2023.01)
CPC H10K 50/844 (2023.02) [H10K 59/12 (2023.02); G09G 3/3275 (2013.01); G09G 3/3283 (2013.01); G09G 3/3291 (2013.01); G09G 2300/0408 (2013.01); H10K 59/122 (2023.02); H10K 59/124 (2023.02); H10K 77/111 (2023.02); H10K 2102/311 (2023.02); H10K 2102/361 (2023.02)] 11 Claims
OG exemplary drawing
 
1. A display device comprising:
a light emitting structure disposed on a substrate; and
a thin film encapsulation layer disposed on the light emitting structure and including an inorganic layer that contains silicon oxynitride and an organic layer,
wherein a portion of the inorganic layer has a stress intensity factor of about 1.6 MPa or more,
wherein the inorganic layer includes:
a first inorganic layer disposed between the light emitting structure and the organic layer and containing silicon oxynitride; and
a second inorganic layer disposed on the organic layer and containing silicon oxynitride,
wherein the first inorganic layer includes:
a first barrier layer contacting the organic layer; and
a second barrier layer contacting the light emitting structure,
wherein the first barrier layer is disposed between the organic layer and the second barrier layer, and
wherein a number of dangling bonds of the first barrier layer is less than a number of dangling bonds of the second barrier layer.