US 12,004,333 B2
Power converter
Shohei Nagai, Nisshin (JP)
Assigned to DENSO CORPORATION, Kariya (JP); TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota (JP); and MIRISE Technologies Corporation, Nisshin (JP)
Filed by DENSO CORPORATION, Kariya (JP); TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota (JP); and MIRISE Technologies Corporation, Nisshin (JP)
Filed on Mar. 2, 2022, as Appl. No. 17/684,469.
Claims priority of application No. 2021-042132 (JP), filed on Mar. 16, 2021.
Prior Publication US 2022/0304198 A1, Sep. 22, 2022
Int. Cl. H05K 7/20 (2006.01); H01L 23/473 (2006.01); H02M 7/537 (2006.01)
CPC H05K 7/20927 (2013.01) [H01L 23/473 (2013.01); H02M 7/537 (2013.01)] 6 Claims
OG exemplary drawing
 
1. A power converter, comprising:
a semiconductor module that includes a semiconductor element for power conversion, the semiconductor module having a module surface on which an input terminal electrically connected to the semiconductor element is disposed;
a capacitor in which a capacitor terminal is disposed, the capacitor having a capacitor surface facing the module surface;
a cooler that is disposed between the semiconductor module and the capacitor; and a connecting member that electrically connects the input terminal and the capacitor terminal, wherein
the cooler includes a groove that passes through the cooler from one side facing the semiconductor module to an other side facing the capacitor,
the groove overlaps the input terminal when viewed in a stacking direction of the semiconductor module, the cooler, and the capacitor,
the groove is filled with an insulation member,
the input terminal includes a positive input terminal and a negative input terminal,
the capacitor terminal includes a positive capacitor terminal and a negative capacitor terminal,
the connecting member includes a positive connecting member that electrically connects the positive input terminal and the positive capacitor terminal and a negative connecting member that electrically connects the negative input terminal and the negative capacitor terminal,
the insulation member has a first surface facing the semiconductor module, a second surface facing the capacitor, and a side surface connecting the first surface and the second surface, and
one of the positive connecting member and the negative connecting member is disposed to extend along the first surface, the side surface, and the second surface of the insulation member.