CPC H05K 7/20927 (2013.01) [H05K 7/20272 (2013.01); H05K 7/209 (2013.01); B60K 11/02 (2013.01); H01G 2/08 (2013.01); H01L 23/473 (2013.01)] | 8 Claims |
1. A system for cooling a power electronics module using a fluid, the system comprising:
a housing comprising a thickness and configured to contain the power electronics module;
a molding comprising at least one slot and configured to extend through the thickness, creating a first seal with the thickness, and contact at least a portion of the power electronics module;
an electrical connection extending through the slot and comprising a planar surface which extends through the molding and a cylindrical extension which extends through the thickness, creating a second seal with the thickness; and
a manifold positioned within the housing; wherein:
the power electronics module comprises a first side and a second side,
the electrical connection is configured to contact at least a portion of the power electronics module,
the manifold is configured to direct the fluid to contact the first side and the second side,
the first seal comprises interlocking grooves of the molding and the thickness,
the second seal comprises interlocking grooves of the cylindrical extension and the thickness, and
the fluid is configured to contact the power electronics module and the electrical connection inside the housing.
|