	US 12,004,318 B2
	Data processing systems including optical communication modules
Peter Johannes Winzer, Aberdeen, NJ (US); Brett Michael Dunn Sawyer, Pasadena, CA (US); Ron Zhang, Sunnyvale, CA (US); Peter James Pupalaikis, Ramsey, NJ (US); Clinton Randy Giles, Watchung, NJ (US); Guilhem de Valicourt, Jersey City, NJ (US); and Jonathan Proesel, Mount Vernon, NY (US)
Assigned to Nubis Communications, Inc., New Providence, NJ (US)
Filed by Nubis Communications, Inc., Aberdeen, NJ (US)
Filed on Feb. 24, 2023, as Appl. No. 18/114,114.
Application 18/114,114 is a continuation of application No. 17/478,483, filed on Sep. 17, 2021.
Application 17/478,483 is a continuation in part of application No. PCT/US2021/035179, filed on Jun. 1, 2021.
Application PCT/US2021/035179 is a continuation in part of application No. PCT/US2021/022730, filed on Mar. 17, 2021.
Claims priority of provisional application 63/245,005, filed on Sep. 16, 2021.
Claims priority of provisional application 63/245,011, filed on Sep. 16, 2021.
Claims priority of provisional application 63/225,779, filed on Jul. 26, 2021.
Claims priority of provisional application 63/223,685, filed on Jul. 20, 2021.
Claims priority of provisional application 63/210,437, filed on Jun. 14, 2021.
Claims priority of provisional application 63/208,759, filed on Jun. 9, 2021.
Claims priority of provisional application 63/192,852, filed on May 25, 2021.
Claims priority of provisional application 63/178,501, filed on Apr. 22, 2021.
Claims priority of provisional application 63/175,021, filed on Apr. 14, 2021.
Claims priority of provisional application 63/173,253, filed on Apr. 9, 2021.
Claims priority of provisional application 63/159,768, filed on Mar. 11, 2021.
Claims priority of provisional application 63/146,421, filed on Feb. 5, 2021.
Claims priority of provisional application 63/145,368, filed on Feb. 3, 2021.
Claims priority of provisional application 63/116,660, filed on Nov. 20, 2020.
Claims priority of provisional application 63/088,914, filed on Oct. 7, 2020.
Claims priority of provisional application 63/080,528, filed on Sep. 18, 2020.
Prior Publication US 2023/0380095 A1, Nov. 23, 2023
Int. Cl. H05K 7/14 (2006.01); G02B 6/42 (2006.01); G02B 6/43 (2006.01); H04B 10/27 (2013.01); H05K 1/14 (2006.01)

CPC H05K 7/1487 (2013.01) [G02B 6/4206 (2013.01); G02B 6/43 (2013.01); H04B 10/27 (2013.01); H05K 1/141 (2013.01)]

30 Claims

1. A system comprising:

a housing comprising a bottom surface;

a first circuit board or a first substrate comprising a first surface at a first angle relative to the bottom surface of the housing, in which the first angle is in a range from 30° to 150°;

at least one data processor mounted directly or indirectly on the first circuit board or the first substrate; and

at least one optical interconnect module mounted directly or indirectly on the first surface of the first circuit board or the first substrate, wherein each optical interconnect module comprises a first optical connector configured to connect to an external optical link, each optical interconnect module comprises a photonic integrated circuit configured to generate a first electrical signal based on an optical signal received from the first optical connector;

wherein the at least one data processor is configured to process data carried in the first electrical signal;

wherein the at least one optical interconnect module comprises:

a second circuit board or a second substrate having a length, a width, and a thickness, in which the length is at least twice the thickness, and the width is at least twice the thickness, the second circuit board or the second substrate has a first surface defined by the length and the width;

an optical input port configured to receive a plurality of channels of optical signals;

a photonic integrated circuit mounted on the second circuit board or the second substrate and configured to generate a plurality of first electrical signals based on the received optical signals; and

an array of first electrical terminals arranged on the first surface of the second circuit board or the second substrate, in which the array of first electrical terminals comprises at least two electrical terminals distributed along the length direction and at least two electrical terminals distributed along the width direction, the first electrical terminals are configured to output the first electrical signals.

13. A system comprising:

a housing comprising a front panel;

a first circuit board or a first substrate oriented at a first angle relative to the front panel, in which the first angle is in a range from −60° to 60°;

at least one data processing module electrically coupled to the first circuit board or the first substrate; and

at least one optical/electrical communication interface module electrically coupled to the first circuit board or the first substrate;

wherein the first circuit board or the first substrate comprises signal paths configured to transmit signals between the at least one data processing module and the at least one optical/electrical communication interface module;

wherein the at least one data processing module is capable of processing data from the at least one optical/electrical communication interface module at a rate of at least 100 gigabits per second, and each of the at least one optical/electrical communication interface module has a bandwidth of at least 10 gigabits per second;

a rackmount server configured to be placed on a rack during operation, wherein the housing comprises an enclosure for the rackmount server, and the rackmount server has an n rack unit form factor, and n is an integer in a range from 1 to 8;

a plurality of optical/electrical communication interfaces electrically coupled to a first surface of the first circuit board or the first substrate,

wherein each of the optical/electrical communication interfaces is configured to receive first optical signals, convert the first optical signals to first electrical signals, and transmit the first electrical signals directly or indirectly to the data processing module; and

wherein each of the optical/electrical communication interfaces is configured to receive second electrical signals directly or indirectly from the at least one data processor, convert the second electrical signals to second optical signals, and output the second optical signals;

wherein the first surface of the first circuit board or the first substrate is oriented to face towards the front panel to allow the optical/electrical communication interface modules to be accessed without removing the rackmount server from the rack, in which accessing one of the optical/electrical communication interface modules includes at least one of attaching the optical/electrical communication interface module to the first circuit board or the first substrate, or removing the optical/electrical communication interface module from the first circuit board or the first substrate.

21. A system comprising:

a housing comprising a bottom panel and a front panel, the front panel comprising a plurality of optical connector parts, each optical connector part is configured to be optically coupled to an external optical fiber cable and an internal optical fiber cable;

a first circuit board or a first substrate positioned in the housing, wherein the first circuit board or the first substrate is oriented at an angle relative to the bottom panel in which the angle is in a range from 30° to 150°;

wherein the first circuit board or the first substrate is substantially parallel to the front panel or at an angle relative to the front panel in which the angle is less than 60°;

a plurality of optical interconnect modules electrically coupled to the first circuit board; and

a plurality of internal optical fiber cables, wherein each internal optical fiber cable is optically coupled to one of the optical interconnect modules and a corresponding optical connector part on the front panel;

wherein at least one of the optical interconnect modules comprises a co-packaged optical module comprising:

a photonic integrated circuit;

an optical connector coupled to a first surface of the photonic integrated circuit; and

a first set of at least two electrical integrated circuits that are coupled to the first surface of the photonic integrated circuit;

wherein the first set of at least two electrical integrated circuits comprise two electrical integrated circuits that are positioned on opposite sides of the optical connector along a plane parallel to the first surface of the photonic integrated circuit.

29. A system comprising:

a housing comprising a bottom surface;

a first circuit board or a first substrate comprising a first surface at a first angle relative to the bottom surface of the housing, in which the first angle is in a range from 30° to 150°;

at least one data processor mounted directly or indirectly on the first circuit board or the first substrate;

wherein the at least one data processor is configured to process data carried in the first electrical signal; and

a first structure attached to the first circuit board or the first substrate, wherein the first structure is configured to enable the at least one optical interconnect module to be removably coupled to the first structure, and the at least one optical interconnect module is configured to enable an optical fiber connector to be removably coupled to the at least one optical interconnect module;

wherein the at least one optical interconnect module comprises an optical module with connector that is configured to hold the photonic integrated circuit in place when the optical module with connector is coupled to the first structure and to enable electronic signals from the photonic integrated circuit to be transmitted to the circuit board; and

wherein the optical module with connector is configured to enable an optical fiber connector to be removably coupled to the optical module with connector, in which the optical module with connector is configured to enable optical signals from the optical fiber connector to be transmitted to the photonic integrated circuit.