US 12,004,308 B2
Process for laminating graphene-coated printed circuit boards
Boaz Atias, Maale Adumim (IL); Elad Mentovich, Tel Aviv (IL); Yaniv Rotem, Nesher (IL); Doron Naveh, Petah-Tikva (IL); Adi Levi, Rosh HaAyin (IL); Yosi Ben-Naim, Eilat (IL); Yaad Eliya, Magen Shaul (IL); Shlomo Danino, Netanya (IL); and Eran Lipp, Hefer (IL)
Assigned to Mellanox Technologies, Ltd., Yokneam (IL); BAR-ILAN University, Ramat Gan (IL); and PCB Technologies Ltd, Migdal Ha'emeq (IL)
Filed by Mellanox Technologies, Ltd., Yokneam (IL); BAR-ILAN UNIVERSITY, Ramat Gan (IL); and PCB Technologies Ltd, Migdal Ha'emeq (IL)
Filed on Jul. 1, 2021, as Appl. No. 17/305,205.
Claims priority of provisional application 63/201,910, filed on May 18, 2021.
Prior Publication US 2022/0377912 A1, Nov. 24, 2022
Int. Cl. H05K 1/02 (2006.01); B32B 15/14 (2006.01); C01B 32/182 (2017.01); C01B 32/184 (2017.01); C08J 7/043 (2020.01); C08J 7/044 (2020.01); C08J 7/046 (2020.01); C08J 7/06 (2006.01); H01L 21/683 (2006.01); H05K 1/09 (2006.01); H05K 3/38 (2006.01); H05K 3/46 (2006.01)
CPC H05K 3/4652 (2013.01) [C01B 32/184 (2017.08); H05K 3/388 (2013.01); H05K 2203/085 (2013.01); H05K 2203/1338 (2013.01)] 34 Claims
OG exemplary drawing
 
1. A lamination stack comprising:
a core;
a first adhesive layer applied to a top surface of the core;
a first graphene-metal structure attached to the top surface of the core via the first adhesive layer, wherein the first graphene-metal structure comprises a first metal layer and a first graphene layer on at least one of a top surface of the first metal layer or a bottom surface of the first metal layer;
a second graphene-metal structure attached to a top surface of the first graphene-metal structure, wherein the second graphene-metal structure comprises a second metal layer and a second graphene layer on at least one of a top surface of the second metal layer or a bottom surface of the second metal layer; and
a second adhesive layer applied to a bottom surface of the core.