US 12,004,307 B2
Short or near short etch rework
Colin Edward Masterson, Rochester, MN (US); John R. Dangler, Rochester, MN (US); Tory Johnson, Rochester, MN (US); Austin Carter, Olmsted, MN (US); and Gunnar Mills, Denver, CO (US)
Assigned to International Business Machines Corporation, Armonk, NY (US)
Filed by International Business Machines Corporation, Armonk, NY (US)
Filed on Jun. 9, 2021, as Appl. No. 17/342,626.
Prior Publication US 2022/0400556 A1, Dec. 15, 2022
Int. Cl. H05K 3/22 (2006.01); H05K 3/06 (2006.01)
CPC H05K 3/225 (2013.01) [H05K 3/064 (2013.01); H05K 3/068 (2013.01); H05K 2203/0126 (2013.01); H05K 2203/0746 (2013.01); H05K 2203/0753 (2013.01); H05K 2203/0766 (2013.01); H05K 2203/175 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A computer-implemented method comprising:
positioning a microfluidic device on a portion of a circuit having a defect;
causing the microfluidic device to dispense etchant that removes the defect of the circuit, wherein a flow of the etchant is controlled to access the portion of the circuit having the defect to thereby etch away the defect, the flow of the etchant being obstructed from accessing other portions of the circuit;
extracting using the microfluidic device the etchant from the portion of the circuit such that the etchant avoids contact with the other portions of the circuit, wherein the portion of the circuit comprises traces with a cavity separating the traces; and
removing the microfluidic device from the circuit, wherein the microfluidic device comprises one or more fins configured to align the microfluidic device to the portion of the circuit, the one or more fins comprising a dimension that substantially blocks the cavity between the traces associated with the portion of the circuit having the defect.