US 12,004,293 B2
Substrate for mounting electronic element, electronic device, and electronic module
Yukio Morita, Kyoto (JP); Noboru Kitazumi, Kyoto (JP); and Yousuke Moriyama, Kyoto (JP)
Assigned to KYOCERA Corporation, Kyoto (JP)
Filed by KYOCERA Corporation, Kyoto (JP)
Filed on Mar. 20, 2023, as Appl. No. 18/186,548.
Application 18/186,548 is a continuation of application No. 16/965,855, granted, now 11,612,056, previously published as PCT/JP2019/003113, filed on Jan. 30, 2019.
Claims priority of application No. 2018-013760 (JP), filed on Jan. 30, 2018; and application No. 2018-084163 (JP), filed on Apr. 25, 2018.
Prior Publication US 2023/0328885 A1, Oct. 12, 2023
Int. Cl. H05K 1/03 (2006.01); H01L 23/12 (2006.01); H01L 23/373 (2006.01); H05K 1/02 (2006.01)
CPC H05K 1/036 (2013.01) [H01L 23/12 (2013.01); H01L 23/373 (2013.01); H05K 1/0203 (2013.01); H05K 1/021 (2013.01); H05K 1/03 (2013.01); H05K 2201/0323 (2013.01); H05K 2201/10416 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A substrate comprising:
a first member; and
a second member covered by the first member, wherein
the second member includes a first plate material and a second plate material each of which is a plate-like member comprising a carbon material,
the first plate material and the second plate material are bonded to each other in a state of being laminated in a first direction which is a thickness direction of the second member,
the second member has a first bonding portion between the first plate material and the second plate material on a side surface extending along the first direction,
the second member further includes a third plate material which is bonded to the second plate material in a state of being laminated from a side opposite to the first plate material, and a second bonding portion between the second plate material and the third plate material,
the first member covers the first bonding portion not to be exposed to an outside and covers the second bonding portion not to be exposed to the outside,
one direction intersecting the first direction is a second direction, and another direction intersecting the first direction and the second direction is a third direction,
in the first direction,
thermal conductivities of both the first plate material and the second plate material are greater than a thermal conductivity of the first member, and
a thermal conductivity of the third plate material is greater than the thermal conductivity of the first member,
the thermal conductivity of the first plate material in the first direction is greater than a thermal conductivity of the first plate material in the second direction,
the thermal conductivity of the second plate material in the first direction is greater than a thermal conductivity of the second plate material in the third direction,
a thermal conductivity of the third plate material in the first direction is greater than a thermal conductivity of the third plate material in the second direction,
in the second direction,
the thermal conductivities of the first plate material and the third plate material are smaller than the thermal conductivity of the first member, and
the thermal conductivity of the second plate material is greater than the thermal conductivity of the first member, and
in the third direction:
thermal conductivities of the first plate material and the third plate material are greater than a thermal conductivity of the first member, and
the thermal conductivity of the second plate material is smaller than the thermal conductivity of the first member.