US 12,004,268 B2
Transferring unit, substrate treating apparatus including the same, and substrate treating method
Ji-Hwan Lee, Suwon-si (KR)
Assigned to SEMES CO., LTD., Chungcheongnam-Do (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Nov. 6, 2020, as Appl. No. 17/091,054.
Claims priority of application No. 10-2019-0141709 (KR), filed on Nov. 7, 2019.
Prior Publication US 2021/0144809 A1, May 13, 2021
Int. Cl. H01L 21/67 (2006.01); H05B 1/02 (2006.01)
CPC H05B 1/0233 (2013.01) [H01L 21/67098 (2013.01)] 13 Claims
OG exemplary drawing
 
6. A substrate treating apparatus comprising:
a housing;
a heating unit including a heating plate positioned inside the housing to heat a substrate; and
a transferring unit positioned inside the housing to transfer the substrate from the heating plate,
wherein the transferring unit includes,
a transferring plate configured to place the substrate,
protrusions protruding upward from the transferring plate to support the substrate,
a cooling unit configured to cool the substrate which is heated, and
an ultrasound applying member configured to apply an ultrasound between the substrate and the transferring plate,
wherein the ultrasound applying member applies the ultrasound in a direction parallel to the substrate.