US 12,003,838 B2
Camera module and molded photosensitive assembly and electronic device
Zhen Huang, Zhejiang (CN); Qimin Mei, Zhejiang (CN); Bojie Zhao, Zhejiang (CN); Zhewen Mei, Zhejiang (CN); Li Liu, Zhejiang (CN); Jiawei Chen, Zhejiang (CN); and Chenxiang Xu, Zhejiang (CN)
Assigned to Ningbo Sunny Opotech Co., Ltd., Zhejiang (CN)
Filed by Ningbo Sunny Opotech Co., Ltd., Zhejiang (CN)
Filed on May 31, 2023, as Appl. No. 18/203,731.
Application 18/203,731 is a division of application No. 17/983,592, filed on Nov. 9, 2022, granted, now 11,706,514.
Application 17/983,592 is a division of application No. 17/266,776, abandoned, previously published as PCT/CN2019/095337, filed on Jul. 10, 2019.
Claims priority of application No. 201810952770.4 (CN), filed on Aug. 21, 2018; application No. 201821351551.2 (CN), filed on Aug. 21, 2018; application No. 201910438885.6 (CN), filed on May 24, 2019; application No. 201910438917.2 (CN), filed on May 24, 2019; application No. 201910439285.1 (CN), filed on May 24, 2019; application No. 201920764689.3 (CN), filed on May 24, 2019; application No. 201920765166.0 (CN), filed on May 24, 2019; and application No. 201920766441.0 (CN), filed on May 24, 2019.
Prior Publication US 2023/0328350 A1, Oct. 12, 2023
Int. Cl. H04N 5/335 (2011.01); B29C 43/18 (2006.01); H04N 23/54 (2023.01); H04N 23/55 (2023.01); H04N 23/57 (2023.01); B29L 11/00 (2006.01); B29L 31/34 (2006.01)
CPC H04N 23/55 (2023.01) [B29C 43/18 (2013.01); H04N 23/54 (2023.01); H04N 23/57 (2023.01); B29L 2011/00 (2013.01); B29L 2031/34 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A molded photosensitive assembly, characterized by comprising:
an imaging assembly, wherein the imaging assembly includes a circuit board and at least one photosensitive element and a plurality of electronic components, and each photosensitive elements is conductively connected to the circuit board, and each electronic component is mounted to the circuit board at intervals;
a molded base, wherein the molded base embeds a part of the imaging assembly, and the molded base has a light window, and a photosensitive region of each photosensitive element respectively corresponds to each light window of the molded base, and the molded base includes at least one first base portion and at least one second base portion, and each second base portion integrally extends inward from an inner circumferential surface of each first base portion along the circuit board, and a first top surface of each first base portion is higher than a second top surface of the second base portion, and the second top surface is lower than a top surface of at least one of the electronic component; and
a filter assembly, wherein the filter assembly includes at least one filter element, and each filter element respectively corresponds to each light window of the molded base.