US 12,003,045 B2
Wireless interconnect for high rate data transfer
Anton Sergeevich Lukyanov, Moscow (RU); and Mikhail Nikolaevich Makurin, Domodedovo (RU)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Jul. 11, 2022, as Appl. No. 17/862,021.
Application 17/862,021 is a continuation of application No. PCT/KR2022/009117, filed on Jun. 27, 2022.
Claims priority of application No. 2021130597 (RU), filed on Oct. 20, 2021.
Prior Publication US 2023/0123113 A1, Apr. 20, 2023
Int. Cl. H01Q 9/04 (2006.01); H01Q 1/36 (2006.01); H01Q 21/06 (2006.01)
CPC H01Q 9/0421 (2013.01) [H01Q 1/36 (2013.01); H01Q 21/065 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A wireless data transfer system comprising:
two antenna structures separated from each other by a gap, each antenna structure including a printed circuit board on which at least one antenna is located,
wherein dummy elements are located around each of the at least one antenna, each dummy element being connected to a load.