US 12,003,029 B2
Three dimensional antenna array module
Seunghwan Yoon, Irvine, CA (US); Zhihui Wang, Tustin, CA (US); Franco De Flaviis, Irvine, CA (US); Alfred Grau Besoli, Irvine, CA (US); Kartik Sridharan, San Diego, CA (US); Ahmadreza Rofougaran, Newport Beach, CA (US); Michael Boers, South Turramurra (AU); Sam Gharavi, Irvine, CA (US); Donghyup Shin, Irvine, CA (US); Farid Shirinfar, Granada Hills, CA (US); Stephen Wu, Fountain Valley, CA (US); and Maryam Rofougaran, Rancho Palos Verdes, CA (US)
Assigned to Movandi Corporation, Irvine, CA (US)
Filed by Movandi Corporation, Irvine, CA (US)
Filed on Sep. 13, 2022, as Appl. No. 17/943,300.
Application 17/943,300 is a continuation of application No. 17/060,182, filed on Oct. 1, 2020, granted, now 11,509,067.
Application 17/060,182 is a continuation of application No. 15/607,750, filed on May 30, 2017, granted, now 10,916,861, issued on Feb. 9, 2021.
Prior Publication US 2023/0006362 A1, Jan. 5, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01Q 21/00 (2006.01); H01Q 1/22 (2006.01); H01Q 9/04 (2006.01); H01Q 21/06 (2006.01)
CPC H01Q 21/065 (2013.01) [H01Q 1/2283 (2013.01); H01Q 9/045 (2013.01); H01Q 21/0025 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An antenna module, comprising:
an antenna substrate;
a plurality of three-dimensional (3-D) antenna cells on a first surface of the antenna substrate;
a plurality of packaged circuitry on a second surface of the antenna substrate, wherein the plurality of packaged circuitry comprises a plurality of radio-frequency (RF) chips on the second surface of the antenna substrate; and
a plurality of supporting balls mounted on the second surface of the antenna substrate,
wherein each of the plurality of 3-D antenna cells comprises a raised antenna patch with a plurality of projections and a plurality of supporting legs, wherein at least a relief cut is provided between one of the plurality of projections and one of the plurality of supporting legs, and wherein the plurality of supporting legs are configured to carry RF signals between a top plate of the raised antenna patch and the plurality of packaged circuitry.