US 12,003,010 B2
Planar balun with non-uniform microstrip line width to improve S-parameter alignment
Lukas Frederik Tiemeijer, Eindhoven (NL); Waqas Hassan Syed, Eindhoven (NL); Ralf Maria Theodoor Pijper, Maastricht (NL); and Harish Nandagopal, Veldhoven (NL)
Assigned to NXP B.V., Eindhoven (NL)
Filed by NXP B.V., Eindhoven (NL)
Filed on Dec. 22, 2021, as Appl. No. 17/558,934.
Prior Publication US 2023/0198114 A1, Jun. 22, 2023
Int. Cl. H01P 1/203 (2006.01); H01P 1/20 (2006.01); H01Q 13/20 (2006.01); H01P 5/10 (2006.01)
CPC H01P 1/20372 (2013.01) [H01P 1/20381 (2013.01); H01Q 13/206 (2013.01); H01P 5/10 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A compact planar balun formed on a substrate, comprising:
a hairpin-shaped conductive microstrip, comprising:
first and second linear segments in parallel with each other having a first end forming first and second differential contacts and having a second end, wherein the first and second linear segments have a first characteristic impedance; and
a U-shaped segment integrally formed at the second end of the first and second linear segments, wherein the U-shaped segment has a second characteristic impedance that is less than the first characteristic impedance; and
a single-ended contact conductively coupled at a location along the first linear segment.