CPC H01L 33/647 (2013.01) [H01L 25/0753 (2013.01); H01L 25/13 (2013.01); H01L 25/167 (2013.01); H01L 33/62 (2013.01); H01L 33/641 (2013.01)] | 20 Claims |
1. A display module comprising:
a substrate;
a ground layer provided in the substrate;
a plurality of self-emissive devices provided on a front surface of the substrate;
a first driver integrated circuit (IC) provided on a rear surface of the substrate; and
a first heat dissipation structure connected to the ground layer, and comprising a first ground pad exposed to the rear surface of the substrate,
wherein the first heat dissipation structure is configured to dissipate heat to the rear surface of the substrate.
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