CPC H01L 33/56 (2013.01) [C09D 127/12 (2013.01); H01L 33/486 (2013.01); H01L 33/58 (2013.01); H01L 33/60 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0058 (2013.01)] | 22 Claims |
1. A light-emitting packaging device, comprising:
a substrate;
a light-emitting diode (LED) chip disposed on said substrate;
an optical element spacedly disposed on said LED chip opposite to said substrate, and having an upper surface and a lower surface that are respectively distal from and proximal to said LED chip; and
a covering member made from a fluorine-containing resin, and being configured to cover said LED chip and at least a portion of said upper surface of said optical element,
wherein said substrate is formed with a recess, said recess being defined by a recess-defining wall that has a bottom wall and a surrounding wall extending upwardly from said bottom wall, said covering member being configured to further fill a portion of said recess that is beneath said lower surface of said optical element,
wherein said surrounding wall of said recess-defining wall and said upper surface of said optical element cooperatively define a gap, said covering member being configured to further fill said gap, and
wherein said light-emitting packaging device further includes a platform unit protruding upwardly from said bottom wall and along said surrounding wall, said optical element being supported by said platform unit.
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