US 12,002,908 B2
Light-emitting packaging device
Junpeng Shi, Fujian (CN); Qiuxia Lin, Fujian (CN); Weng-Tack Wong, Fujian (CN); and Changchin Yu, Fujian (CN)
Assigned to QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD., Fujian (CN)
Filed by QUANZHOU SANAN SEMICONDUCTOR TECHNOLOGY CO., LTD., Fujian (CN)
Filed on May 13, 2021, as Appl. No. 17/319,757.
Application 17/319,757 is a continuation in part of application No. PCT/CN2018/116256, filed on Nov. 19, 2018.
Claims priority of application No. 202022541708.1 (CN), filed on Nov. 6, 2020.
Prior Publication US 2021/0305471 A1, Sep. 30, 2021
Int. Cl. H01L 33/00 (2010.01); C09D 127/12 (2006.01); H01L 33/48 (2010.01); H01L 33/56 (2010.01); H01L 33/58 (2010.01); H01L 33/60 (2010.01)
CPC H01L 33/56 (2013.01) [C09D 127/12 (2013.01); H01L 33/486 (2013.01); H01L 33/58 (2013.01); H01L 33/60 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0058 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A light-emitting packaging device, comprising:
a substrate;
a light-emitting diode (LED) chip disposed on said substrate;
an optical element spacedly disposed on said LED chip opposite to said substrate, and having an upper surface and a lower surface that are respectively distal from and proximal to said LED chip; and
a covering member made from a fluorine-containing resin, and being configured to cover said LED chip and at least a portion of said upper surface of said optical element,
wherein said substrate is formed with a recess, said recess being defined by a recess-defining wall that has a bottom wall and a surrounding wall extending upwardly from said bottom wall, said covering member being configured to further fill a portion of said recess that is beneath said lower surface of said optical element,
wherein said surrounding wall of said recess-defining wall and said upper surface of said optical element cooperatively define a gap, said covering member being configured to further fill said gap, and
wherein said light-emitting packaging device further includes a platform unit protruding upwardly from said bottom wall and along said surrounding wall, said optical element being supported by said platform unit.