US 12,002,833 B2
Light detecting device with multiple substrates
Hideto Hashiguchi, Kanagawa (JP); Reijiroh Shohji, Tokyo (JP); Hiroshi Horikoshi, Tokyo (JP); Ikue Mitsuhashi, Kanagawa (JP); Tadashi Iijima, Kanagawa (JP); Takatoshi Kameshima, Kanagawa (JP); Minoru Ishida, Tokyo (JP); and Masaki Haneda, Kanagawa (JP)
Assigned to Sony Semiconductor Solutions Corporation, Kanagawa (JP)
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Filed on Sep. 27, 2022, as Appl. No. 17/954,054.
Application 17/954,054 is a continuation of application No. 17/215,690, filed on Mar. 29, 2021, granted, now 11,476,294.
Application 17/215,690 is a continuation of application No. 16/498,757, granted, now 10,998,369, previously published as PCT/JP2018/011567, filed on Mar. 23, 2018.
Claims priority of application No. 2017-074810 (JP), filed on Apr. 4, 2017; and application No. 2017-156733 (JP), filed on Aug. 15, 2017.
Prior Publication US 2023/0020137 A1, Jan. 19, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 27/146 (2006.01)
CPC H01L 27/14636 (2013.01) [H01L 27/14603 (2013.01); H01L 27/14609 (2013.01); H01L 27/1464 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A light detecting device, comprising:
a first substrate including a first semiconductor substrate and a first wiring layer, the first semiconductor substrate having a pixel;
a second substrate including a second semiconductor substrate and a second wiring layer, the second semiconductor substrate having a first circuit;
a third substrate including a third semiconductor substrate and a third wiring layer, the third semiconductor substrate having a second circuit;
a first coupling structure, wherein the first coupling structure includes a via that extends through the second semiconductor substrate, wherein the first coupling structure electrically connects a first wiring of the first wiring layer to a first wiring of the second wiring layer; and
an electrode junction structure, wherein the electrode junction structure connects the second wiring layer to the third wiring layer, wherein the electrode junction structure includes a second wiring of the second wiring layer and a first wiring of the third wiring layer, wherein a portion of the second wiring of the second wiring layer is exposed at a surface of the second wiring layer, wherein a portion of the first wiring of the third wiring layer is exposed at a surface of the third wiring layer, and wherein at least a portion of the exposed portion of the second wiring of the second wiring layer is in contact with at least a portion of the exposed portion of the third wiring layer.