US 12,002,795 B2
Pluggable CPU modules with vertical power
Houle Gan, Santa Clara, CA (US); Richard Stuart Roy, Mountain View, CA (US); Yujeong Shim, Cupertino, CA (US); William F. Edwards, Jr., Livermore, CA (US); and Chenhao Nan, Santa Clara, CA (US)
Assigned to Google LLC, Mountain View, CA (US)
Filed by Google LLC, Mountain View, CA (US)
Filed on Apr. 13, 2022, as Appl. No. 17/719,857.
Prior Publication US 2023/0335541 A1, Oct. 19, 2023
Int. Cl. H05K 1/11 (2006.01); H01L 25/16 (2023.01); H05K 1/18 (2006.01); H01L 23/00 (2006.01)
CPC H01L 25/162 (2013.01) [H05K 1/11 (2013.01); H05K 1/183 (2013.01); H01L 24/16 (2013.01); H01L 2224/16225 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/1003 (2013.01); H05K 2201/10159 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/1053 (2013.01); H05K 2201/10704 (2013.01); H05K 2201/10719 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An assembly comprising:
a pluggable processor module comprising:
a microprocessor package;
a voltage regulator including a capacitor board, a power board, and conductive pillars connecting the capacitor board to the power board; and
a contact that includes a first side in contact with the microprocessor package and a second side in contact with the capacitor board; and
a printed circuit board assembly (“PCBA”) including a module aperture that is large enough to receive the power board and narrower than the capacitor board.