US 12,002,792 B2
Method and system for transferring alignment marks between substrate systems
David Trung Doan, Hsinchu County (TW); Yoshinori Ogawa, Kanagawa (JP); and Nobuaki Matsumoto, Gunma (JP)
Assigned to SemiLEDs Corporation, Chu-Nan (TW); and Shin-Etsu Chemical Co. Ltd., Tokyo (JP)
Filed by SemiLEDs Corporation, Chu-Nan (TW); and Shin-Etsu Chemical Co. Ltd., Tokyo (JP)
Filed on Nov. 18, 2022, as Appl. No. 17/989,770.
Application 17/989,770 is a continuation of application No. 17/241,324, filed on Apr. 27, 2021, granted, now 11,545,474.
Claims priority of provisional application 63/022,579, filed on May 11, 2020.
Prior Publication US 2023/0134997 A1, May 4, 2023
Int. Cl. H01L 25/075 (2006.01); H01L 21/68 (2006.01); H01L 33/00 (2010.01)
CPC H01L 25/0753 (2013.01) [H01L 21/68 (2013.01); H01L 33/0093 (2020.05)] 18 Claims
OG exemplary drawing
 
1. A system for transferring alignment marks between substrate systems comprising:
a substrate comprising a plurality of semiconductor devices and a plurality of alignment marks in alignment with the semiconductor devices, the alignment marks comprising physical structures that can be physically transferred between substrate systems; and
a first substrate system comprising a temporary substrate having an adhesive layer thereon configured to contact and apply adhesive forces to the semiconductor devices and the alignment marks, the temporary substrate configured to support and bond with the semiconductor devices and the alignment marks while maintaining the alignment between the semiconductor devices and the alignment marks, the adhesive layer configured to maintain the adhesive forces during bonding and separating of the substrate from the temporary substrate.