CPC H01L 23/5386 (2013.01) [H01L 23/48 (2013.01); H01L 23/5383 (2013.01); H01L 25/0655 (2013.01)] | 20 Claims |
1. A package substrate comprising:
a core insulation;
an upper insulation pattern arranged on the core insulation layer, wherein the upper insulation pattern includes an upper trench;
a lower insulation pattern arranged on the core insulation layer, wherein the lower insulation pattern includes a lower trench; and
a reinforcing portion arranged in at least one of the upper trench or the lower trench.
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