US 12,002,759 B2
Apparatuses including a conductive contact including a dielectric material surrounded by a conductive material
Jordan D. Greenlee, Boise, ID (US); Lifang Xu, Boise, ID (US); Rita J. Klein, Boise, ID (US); Xiao Li, Boise, ID (US); and Everett A. McTeer, Eagle, ID (US)
Filed by Lodestar Licensing Group LLC, Evanston, IL (US)
Filed on Apr. 26, 2022, as Appl. No. 17/660,669.
Application 17/660,669 is a continuation of application No. 16/702,222, filed on Dec. 3, 2019, granted, now 11,342,265.
Prior Publication US 2022/0254727 A1, Aug. 11, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/532 (2006.01); H01L 21/768 (2006.01); H01L 23/00 (2006.01); H01L 23/522 (2006.01); H10B 41/27 (2023.01); H10B 41/41 (2023.01)
CPC H01L 23/53266 (2013.01) [H01L 21/76846 (2013.01); H01L 23/5226 (2013.01); H01L 23/562 (2013.01); H10B 41/27 (2023.02); H10B 41/41 (2023.02)] 20 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
one or more insulative materials; and
a conductive contact within a contact via extending through the one or more insulative materials, the conductive contact comprising:
a conductive material adjacent to the one or more insulative materials; and
a dielectric material adjacent to and at least partially surrounded by the conductive material.
 
8. An apparatus, comprising:
an insulative material extending through a staircase region and a memory array region adjacent to the staircase region;
conductive contacts extending through the insulative material within the staircase region, the conductive contacts comprising:
a dielectric material; and
a conductive material intervening between the insulative material and the dielectric material, the conductive material at least partially surrounding the dielectric material.
 
14. An apparatus, comprising:
conductive contacts within contact vias extending through one or more insulative materials, the conductive contacts comprising a dielectric material and a conductive material interposed between the dielectric material and the one or more insulative materials; and
at least one barrier material comprising a nitride material interposed between the conductive material of the conductive contacts and the one or more insulative materials, the at least one barrier material extending at least partially along a height of the conductive material.