US 12,002,740 B2
Printed circuit board, power semiconductor module arrangement comprising a printed circuit board, and method for assembling the same
Sebastian Michalski, Berlin (DE); and Guido Bönig, Warstein (DE)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Jan. 25, 2023, as Appl. No. 18/101,198.
Claims priority of application No. 22153588 (EP), filed on Jan. 27, 2022.
Prior Publication US 2023/0238314 A1, Jul. 27, 2023
Int. Cl. H01L 23/498 (2006.01); H01L 21/48 (2006.01); H05K 1/02 (2006.01); H01L 23/00 (2006.01); H01L 23/053 (2006.01); H01L 25/07 (2006.01)
CPC H01L 23/49811 (2013.01) [H01L 21/4853 (2013.01); H05K 1/0263 (2013.01); H01L 23/053 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 25/072 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/73265 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A printed circuit board comprises:
a dielectric insulation layer having a top side facing a first side and a bottom side opposite the first side that faces a second side of the dielectric insulation layer;
at least one conducting track formed on the dielectric insulation layer; and
one or more conductor rails, wherein
each of the one or more conductor rails is mechanically coupled to the dielectric insulation layer, and
a first portion of each of the one or more conductor rails is arranged on the first side and a second portion of each of the one or more conductor rails is arranged on the second side of the dielectric insulation layer.