US 12,002,739 B2
Semiconductor device including an embedded semiconductor die
Edward Fuergut, Dasing (DE); Achim Althaus, Regensburg (DE); Martin Gruber, Schwandorf (DE); Marco Nicolas Mueller, Villach (AT); Bernd Schmoelzer, Radenthein (AT); Wolfgang Scholz, Olching (DE); and Mark Thomas, Bodensdorf (AT)
Assigned to Infineon Technologies Austria AG, Villach (AT)
Filed by Infineon Technologies Austria AG, Villach (AT)
Filed on Feb. 11, 2021, as Appl. No. 17/173,757.
Claims priority of application No. 20156858 (EP), filed on Feb. 12, 2020.
Prior Publication US 2021/0249334 A1, Aug. 12, 2021
Int. Cl. H01L 23/485 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/13 (2006.01); H01L 23/14 (2006.01); H01L 23/495 (2006.01); H01L 23/498 (2006.01)
CPC H01L 23/485 (2013.01) [H01L 21/56 (2013.01); H01L 23/3135 (2013.01); H01L 23/13 (2013.01); H01L 23/142 (2013.01); H01L 23/49548 (2013.01); H01L 23/49861 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a die carrier;
a semiconductor die disposed on the die carrier, the semiconductor die comprising one or more contact pads;
an encapsulant covering at least partially the semiconductor die and at least a portion of a main face of the die carrier;
an insulation layer covering the encapsulant on an upper main face and on side faces of the encapsulant;
one or more electrical interconnects, each being connected with one of the one or more contact pads of the semiconductor die and extending through the encapsulant; and
a printed circuit board (PCB),
wherein the die carrier is disposed within an opening portion of the PCB,
wherein the insulation layer reaches through a space between side faces of the die carrier and side faces of the PCB to a backside of the die carrier and a backside of the PCB.