CPC H01L 23/4735 (2013.01) [H01L 23/38 (2013.01); H01L 23/40 (2013.01)] | 20 Claims |
1. A jet impingement cooling assembly for semiconductor devices, comprising:
a heat exchange base having an inlet chamber and an outlet chamber sharing a bottom surface;
an inlet connection in fluid connection with the inlet chamber;
an outlet connection in fluid connection with the outlet chamber;
a jet plate coupled to the inlet chamber and having a jet plate surface parallel to the bottom surface;
a jet pedestal formed on the jet plate and having a raised surface with a jet nozzle formed therein; and
a chamber divider within the heat exchange base and attached to the jet plate and to the bottom surface, with the inlet chamber being adjacent to the jet plate and a first side of the chamber divider, and the outlet chamber being adjacent to a second side of the chamber divider.
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