US 12,002,736 B2
Jet impingement cooling for high power semiconductor devices
Jesse Emmett Galloway, Chandler, AZ (US)
Assigned to SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Scottsdale, AZ (US)
Filed by SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC, Phoenix, AZ (US)
Filed on Feb. 6, 2023, as Appl. No. 18/164,734.
Application 18/164,734 is a continuation of application No. 16/675,540, filed on Nov. 6, 2019, granted, now 11,600,550.
Claims priority of provisional application 62/913,563, filed on Oct. 10, 2019.
Prior Publication US 2023/0187312 A1, Jun. 15, 2023
Int. Cl. H01L 23/38 (2006.01); H01L 23/473 (2006.01); H01L 23/40 (2006.01)
CPC H01L 23/4735 (2013.01) [H01L 23/38 (2013.01); H01L 23/40 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A jet impingement cooling assembly for semiconductor devices, comprising:
a heat exchange base having an inlet chamber and an outlet chamber sharing a bottom surface;
an inlet connection in fluid connection with the inlet chamber;
an outlet connection in fluid connection with the outlet chamber;
a jet plate coupled to the inlet chamber and having a jet plate surface parallel to the bottom surface;
a jet pedestal formed on the jet plate and having a raised surface with a jet nozzle formed therein; and
a chamber divider within the heat exchange base and attached to the jet plate and to the bottom surface, with the inlet chamber being adjacent to the jet plate and a first side of the chamber divider, and the outlet chamber being adjacent to a second side of the chamber divider.