US 12,002,732 B2
Copper/ceramic assembly, insulated circuit board, method for producing copper/ceramic assembly, and method for producing insulated circuit board
Nobuyuki Terasaki, Saitama (JP)
Assigned to MITSUBISHI MATERIALS CORPORATION, Tokyo (JP)
Appl. No. 17/615,213
Filed by MITSUBISHI MATERIALS CORPORATION, Tokyo (JP)
PCT Filed Jun. 23, 2020, PCT No. PCT/JP2020/024500
§ 371(c)(1), (2) Date Nov. 30, 2021,
PCT Pub. No. WO2021/033421, PCT Pub. Date Feb. 25, 2021.
Claims priority of application No. 2019-151166 (JP), filed on Aug. 21, 2019.
Prior Publication US 2022/0230935 A1, Jul. 21, 2022
Int. Cl. H01L 23/373 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/3735 (2013.01) [H01L 21/4857 (2013.01); H01L 21/4871 (2013.01); H01L 23/3733 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 2224/29109 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/32225 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A copper/ceramic bonded body comprising:
a copper member made of copper or a copper alloy; and
a ceramic member made of oxygen-containing ceramics,
wherein the copper member and the ceramic member are bonded to each other,
a magnesium oxide layer is formed on a ceramic member side between the copper member and the ceramic member, and
an active metal oxide phase composed of an oxide of one or more active metals selected from Ti, Zr, Nb, and Hf is dispersed inside a copper layer in contact with the magnesium oxide layer.