US 12,002,730 B2
Semiconductor module
Ikumi Fukuda, Tokyo (JP)
Assigned to Mitsubishi Electric Corporation, Tokyo (JP)
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
Filed on Oct. 18, 2021, as Appl. No. 17/503,990.
Claims priority of application No. 2020-218508 (JP), filed on Dec. 28, 2020.
Prior Publication US 2022/0208639 A1, Jun. 30, 2022
Int. Cl. H01L 23/367 (2006.01); H01L 23/00 (2006.01); H01L 23/13 (2006.01); H01L 23/498 (2006.01); H01L 23/495 (2006.01)
CPC H01L 23/3677 (2013.01) [H01L 23/13 (2013.01); H01L 23/49827 (2013.01); H01L 24/73 (2013.01); H01L 23/49537 (2013.01); H01L 23/49575 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/48227 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A semiconductor module comprising:
a plurality of semiconductor chips;
a module substrate on which the plurality of semiconductor chips are mounted;
a heat sink on which the module substrate is mounted; and
a filler filled between the module substrate and the heat sink, wherein
the module substrate includes
a heat radiating plate, and
an insulating substrate provided on the heat radiating plate and on which the plurality of semiconductor chips are mounted,
the heat radiating plate has a plurality of recess portions provided on a surface facing the heat sink and at least one groove,
the plurality of recess portions are provided in regions corresponding to below arrangement regions of the plurality of semiconductor chips,
the at least one groove is provided in a region corresponding to below a region between at least one of the plurality of semiconductor chips and an adjacent other semiconductor chip, and
the filler also is filled in the plurality of recess portions.