	US 12,002,726 B2
	Semiconductor package and method of manufacture
Jinwoo Park, Seoul (KR); Jongho Lee, Hwaseong-si (KR); and Yeongkwon Ko, Hwaseong-si (KR)
Assigned to Samsung Electronics Co., Ltd., (KR)
Filed by SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed on Feb. 22, 2023, as Appl. No. 18/112,715.
Application 18/112,715 is a continuation of application No. 17/177,725, filed on Feb. 17, 2021, granted, now 11,610,828.
Claims priority of application No. 10-2020-0113839 (KR), filed on Sep. 7, 2020.
Prior Publication US 2023/0197549 A1, Jun. 22, 2023
Int. Cl. H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/29 (2006.01); H01L 23/498 (2006.01); H01L 25/00 (2006.01); H01L 25/18 (2023.01)

CPC H01L 23/3157 (2013.01) [H01L 21/568 (2013.01); H01L 23/293 (2013.01); H01L 23/49816 (2013.01); H01L 23/49827 (2013.01); H01L 24/16 (2013.01); H01L 25/18 (2013.01); H01L 25/50 (2013.01); H01L 2224/1012 (2013.01); H01L 2224/14 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/8185 (2013.01)]

20 Claims

1. A method of manufacture for a semiconductor package, the method comprising:

arranging at least one semiconductor chip on an upper surface of an interposer;

forming a molding member on side surfaces of the at least one semiconductor chip;

using an adhesive to attach a carrier substrate to an upper surface of the molding member and an upper surface of the at least one semiconductor chip;

using a first blade having a first blade-width to cut away selected portions of the carrier substrate and cut away portions of the adhesive underlying the selected portions of the carrier substrate, and using the first blade to partially cut into an upper surface of the molding member to form a first cutting groove, wherein the selected portions of the carrier substrate are disposed above portions of the molding member;

using a second blade having a second blade-width narrower than the first blade-width to cut through the interposer and at least partially into a lower surface of the molding member to form a second cutting groove, wherein a combination of the first cutting groove and the second cutting groove separates a package structure including a cut portion of the interposer and the at least one semiconductor chip, collectively supported by a cut portion of the carrier substrate; and

bonding the package structure to an upper surface of a package substrate.

8. A method of manufacture for a semiconductor package, the method comprising:

forming a molding member on side surfaces of semiconductor chips;

using an adhesive to attach a carrier substrate to an upper surface of the molding member and an upper surface of the semiconductor chips;

using a first blade having a first blade-width to cut away selected portions of the carrier substrate and portions of the adhesive underlying the selected portions of the carrier substrate, and to partially cut into an upper surface of the molding member to form a first cutting groove, wherein the selected portions of the carrier substrate are dispose above portions of the molding member between adjacent ones of the semiconductor chips;

using a second blade having a second blade-width narrower than the first blade-width to cut through a lower surface of the molding member to form a second cutting groove, wherein a combination of the first cutting groove and the second cutting groove separate a package structure including a semiconductor chip supported by a cut portion of the carrier substrate; and

bonding the package structure to an upper surface of a package substrate.

11. A method of manufacture for a semiconductor package, the method comprising:

arranging a first semiconductor chip, a first stacked plurality of second semiconductor chips and a second stacked plurality of second semiconductor chips on an upper surface of an interposer;

forming a molding member on side surfaces of the first semiconductor chip, the first stacked plurality of second semiconductor chips and the second stacked plurality of second semiconductor chips;

using a first blade having a first blade-width to partially cut into an upper surface of the molding member to form a first cutting groove;

using a second blade having a second blade-width narrower than the first blade-width to cut through the interposer and at least partially into a lower surface of the molding member to form a second cutting groove, wherein a combination of the first cutting groove and the second cutting groove separates a package structure including a cut portion of the interposer, the first semiconductor chip and the first stacked plurality of second semiconductor chips; and

bonding the package structure to an upper surface of a package substrate.

16. A method of manufacture for a semiconductor package, the method comprising:

providing a first semiconductor chip, a first stacked plurality of second semiconductor chips and a second stacked plurality of second semiconductor chips;

forming a molding member on side surfaces of the first semiconductor chip, the first stacked plurality of second semiconductor chips and the second stacked plurality of second semiconductor chips;

using an adhesive to attach a carrier substrate to an upper surface of the molding member, an upper surface of the first semiconductor chip, an upper surface of the first stacked plurality of second semiconductor chips and an upper surface of the second stacked plurality of second semiconductor chips;

using a second blade having a second blade-width narrower than the first blade-width to cut through an interposer and at least partially into a lower surface of the molding member to form a second cutting groove, wherein a combination of the first cutting groove and the second cutting groove separate a package structure including the first semiconductor chip and the first stacked plurality of second semiconductor chips, collectively supported by a cut portion of the carrier substrate; and

bonding the package structure to an upper surface of a package substrate.