CPC H01L 21/67092 (2013.01) [H01L 21/67023 (2013.01); H01L 21/76254 (2013.01)] | 20 Claims |
1. A system for fracturing a plurality of wafer assemblies, one wafer of each assembly comprising an embrittlement plane and each assembly comprising a peripheral side groove, the system comprising:
a cradle configured to keep the assemblies of the plurality of wafer assemblies spaced apart from and parallel to each other along a storage axis;
a separation device configured to apply separation forces in the peripheral side groove of an assembly disposed in a fracture zone of the separation device, the separation forces being intended to separate wafers of the assembly from each other so as to initiate the fracturing thereof on the embrittlement plane; and
a drive device configured to move along an axis for storing the cradle opposite the separation device so as to successively place an assembly of the cradle in the fracture zone of the separation device.
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