US 12,002,685 B2
Method for packaging chip
Baoguan Yin, Shandong (CN); Fei She, Shandong (CN); Dewen Tian, Shandong (CN); and Qinglin Song, Shandong (CN)
Assigned to Weifang Goertek Microelectronics Co., Ltd., Shandong (CN)
Appl. No. 17/620,345
Filed by Weifang Goertek Microelectronics Co., Ltd., Shandong (CN)
PCT Filed Dec. 6, 2019, PCT No. PCT/CN2019/123551
§ 371(c)(1), (2) Date Dec. 17, 2021,
PCT Pub. No. WO2020/253146, PCT Pub. Date Dec. 24, 2020.
Claims priority of application No. 201910522476.4 (CN), filed on Jun. 17, 2019.
Prior Publication US 2022/0367209 A1, Nov. 17, 2022
Int. Cl. H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01)
CPC H01L 21/4875 (2013.01) [H01L 21/4878 (2013.01); H01L 21/56 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A method for packaging a chip, comprising:
providing a baseplate formed with an open slot thereon penetrating through opposite sides of the baseplate;
providing a release base material, wherein the release base material is bonded to a first side of the baseplate and covers the open slot;
providing a first chip, wherein the first chip is mounted on the release base material at the position of the open slot;
packaging a second side of the baseplate facing away from the release base material so as to form a packaging layer which packages the first chip to be fixed on the baseplate; and
removing the release base material to obtain a package structure for the first chip;
wherein the providing the first chip further comprises mounting the first chip on the release base material in a manner in which pins thereon face the release base material, mounting a second chip on the first chip in a manner in which pins thereon face away from the release base material, wherein the pins of the second chip are conducted to the baseplate through respective leads;
wherein the packaging the second side of the baseplate further comprises, packaging the first chip, the second chip and the leads of the second chip and fixing all on the baseplate; and
the method further comprises after removing the release base material, conducting the pins of the first chip to the baseplate through leads, and packaging the first chip and its pins from the first side of the baseplate.