US 12,002,666 B2
Measuring device, measuring method, and vacuum processing apparatus
Atsushi Sawachi, Miyagi (JP); Ichiro Sone, Miyagi (JP); Takuya Nishijima, Miyagi (JP); and Suguru Sato, Miyagi (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed on Dec. 5, 2020, as Appl. No. 17/113,031.
Claims priority of application No. 2019-221379 (JP), filed on Dec. 6, 2019.
Prior Publication US 2021/0175055 A1, Jun. 10, 2021
Int. Cl. H01J 37/32 (2006.01); G01J 3/443 (2006.01)
CPC H01J 37/32972 (2013.01) [G01J 3/443 (2013.01); H01J 37/32733 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A measuring device for measuring a state in a processing chamber of a vacuum processing apparatus, the measuring device being detachably attached to the processing chamber, the measuring device comprising:
a measuring mechanism configured to measure a state in the processing chamber;
a first case in which the measuring mechanism is accommodated;
a second case communicating with the first case through an openable shutter member, having an opening for connecting with a gate of the processing chamber, and being located between the first case and the processing chamber; and
a decompressing mechanism configured to reduce pressure in the first case and pressure in the second case.