US 12,002,614 B2
Inductor made of component carrier material comprising electrically conductive plate structures
Johannes Stahr, St.Lorenzen (AT); Gerald Weidinger, Leoben (AT); and Heinz Moitzi, Zeltweg (AT)
Assigned to AT&S Austria Technologie & Systemtechnik AG, Leoben (AT)
Filed by AT&S Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben (AT)
Filed on Nov. 4, 2020, as Appl. No. 16/949,573.
Application 16/949,573 is a continuation of application No. 15/851,177, filed on Dec. 21, 2017, granted, now 10,861,636.
Claims priority of application No. 16206372 (EP), filed on Dec. 22, 2016.
Prior Publication US 2021/0050141 A1, Feb. 18, 2021
This patent is subject to a terminal disclaimer.
Int. Cl. H01F 27/28 (2006.01); H01F 17/00 (2006.01); H01F 27/24 (2006.01); H01F 41/04 (2006.01); H05K 1/18 (2006.01)
CPC H01F 27/2804 (2013.01) [H01F 17/0013 (2013.01); H01F 27/24 (2013.01); H01F 27/2847 (2013.01); H01F 41/041 (2013.01); H01F 41/042 (2013.01); H01F 41/046 (2013.01); H01F 17/0033 (2013.01); H05K 1/181 (2013.01); H05K 1/185 (2013.01); H05K 2201/1003 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A component carrier, comprising:
a stack comprising at least one electrically conductive layer structure and at least one electrically insulating layer structure;
an inductor embedded in or surface mounted on the stack, the inductor having a plurality of stacked layer structures made of component carrier material and electrically conductive plate structures; and
a plurality of electrically conductive interconnect structures connecting the electrically conductive plate structures to thereby form an inductance with multiple windings, wherein a stacking direction of the stack is slanted or perpendicular to a stacking direction of the stacked layer structures.