US 12,001,539 B2
Interfacing with a one-wire device that is in parallel with a low-impedance element, and related systems and devices
Daniel J. Russell, Colorado Springs, CO (US); Albert S. Weiner, Colorado Springs, CO (US); and Suraj Sridhar, Colorado Springs, CO (US)
Assigned to Microchip Technology Incorporated, Chandler, AZ (US)
Filed by Microchip Technology Incorporated, Chandler, AZ (US)
Filed on Jul. 19, 2022, as Appl. No. 17/813,558.
Application 17/813,558 is a division of application No. 16/803,865, filed on Feb. 27, 2020, granted, now 11,429,709.
Claims priority of provisional application 62/913,283, filed on Oct. 10, 2019.
Prior Publication US 2022/0358204 A1, Nov. 10, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H04L 29/06 (2006.01); G06F 21/44 (2013.01)
CPC G06F 21/44 (2013.01) 21 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a replaceable module comprising:
an element electrically coupled between a first line and a second line, the element forming a first current path between the first line and the second line; and
a one-wire authentication element electrically in parallel with the element between the first line and the second line, the one-wire authentication element forming a second current path between the first line and the second line, the one-wire authentication element to provide an authentication response,
wherein the replaceable module to divide a first current into a second current along the first current path and a third current along the second current path, and
wherein the one-wire authentication element to modulate the first current utilizing the third current.