US 12,001,363 B2
Secure enclave system-in-package
Peter Robert Linder, Sugar Land, TX (US); Masood Murtuza, Sugar Land, TX (US); Erik James Welsh, Bellaire, TX (US); and William Arthur Fitzhugh Lee, Spicewood, TX (US)
Assigned to OCTAVO SYSTEMS LLC, Sugar Land, TX (US)
Appl. No. 17/926,438
Filed by Octavo Systems LLC, Sugar Land, TX (US)
PCT Filed May 21, 2021, PCT No. PCT/US2021/033667
§ 371(c)(1), (2) Date Nov. 18, 2022,
PCT Pub. No. WO2021/237099, PCT Pub. Date Nov. 25, 2021.
Claims priority of provisional application 63/029,037, filed on May 22, 2020.
Prior Publication US 2023/0185748 A1, Jun. 15, 2023
Int. Cl. G06F 13/36 (2006.01); G06F 15/78 (2006.01)
CPC G06F 13/36 (2013.01) [G06F 15/7807 (2013.01)] 18 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
at least one startup component;
at least one configurable hardware device;
at least one trust component; and
at least one SiP substrate, wherein said at least one startup component, said at least one configurable hardware device, and said at least one trust component are mounted on said at least one SiP substrate and operatively interconnected, and
wherein said at least one startup component, said at least one configurable hardware device, and said at least one trust component are packaged together to form a first System-in-Package (SiP) device, and
wherein the apparatus is a second SiP device that includes the first SiP device.