US 12,001,193 B2
Apparatus for environmental control of dies and substrates for hybrid bonding
Ying Wang, Singapore (SG); Xundong Dai, Singapore (SG); Guan Huei See, Singapore (SG); Ruiping Wang, San Jose, CA (US); Michael R. Rice, Pleasanton, CA (US); Hari Kishen Ponnekanti, San Jose, CA (US); and Nirmalya Maity, Menlo Park, CA (US)
Assigned to APPLIED MATERIALS, INC., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Mar. 11, 2022, as Appl. No. 17/692,671.
Prior Publication US 2023/0288916 A1, Sep. 14, 2023
Int. Cl. G05B 19/41 (2006.01); G05B 19/418 (2006.01); H01L 21/67 (2006.01); H01L 21/68 (2006.01); H01L 21/687 (2006.01)
CPC G05B 19/418 (2013.01) [H01L 21/67121 (2013.01); H01L 21/68771 (2013.01); H01L 21/68778 (2013.01); G05B 2219/45031 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An apparatus for extending a queue time of a die or a substrate for hybrid bonding, comprising:
an environmentally controllable space with a support for holding at least one die or substrate;
a gas velocity accelerator that recirculates one or more gases laterally across the support;
a filter which impedes on the one or more gases prior to the one or more gases flowing laterally across the support;
a humidifier apparatus that is fluidly connected to the environmentally controllable space, wherein the humidifier apparatus enables controllable humidity levels within the environmentally controllable space;
a pressurizing apparatus fluidly connected to the humidifier apparatus on an output and fluidly connected to at least one gas supply on an input;
a relative humidity (RH) sensor positioned within the environmentally controllable space; and
an environment controller in communication with at least the humidifier apparatus and the RH sensor, and the pressurizing apparatus, wherein the environment controller is configured to maintain an RH level of approximately 80% to approximately 95% and a pressure of less than approximately 60 PSI in the environmentally controllable space.