CPC G02F 1/133605 (2013.01) [G02F 1/133603 (2013.01); G02F 1/133607 (2021.01)] | 13 Claims |
1. An LED backlighting system
comprising a carrier, an optoelectronic semiconductor chip arrangement, a reflector and a diffuser element,
wherein the optoelectronic semiconductor chip arrangement is arranged at a top side of the carrier,
wherein the reflector has a through opening extending between a lower opening at an underside of the reflector and an upper opening at a top side of the reflector,
wherein the reflector is arranged at the top side of the carrier,
wherein the underside of the reflector faces the top side of the carrier,
wherein the optoelectronic semiconductor chip arrangement is arranged in the through opening of the reflector,
wherein the diffuser element has a top side and an underside,
wherein the diffuser element is arranged over the top side of the reflector,
wherein the underside of the diffuser element faces the top side of the reflector, and
wherein the underside of the diffuser element is embodied as a freeform surface,
wherein the diffuser element has a center axis ROOM defined by a central point of its top side and a central point of its underside,
wherein a thickness of the diffuser element measured between the underside of the diffuser element and the top side of the diffuser element parallel to the center axis has different values in different regions of the diffuser element,
wherein the thickness of the diffuser element has a larger value at a location along a diagonal plane than at the center axis of the diffuser element.
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