US 12,001,038 B2
Patterned wavelength-selective film
Kui Chen-Ho, Woodbury, MN (US); Douglas S. Dunn, Woodbury, MN (US); Tien Yi T. H. Whiting, St. Paul, MN (US); Bryan T. Whiting, St. Paul, MN (US); Taylor J. Kobe, Woodbury, MN (US); Anthony F. Schultz, Forest Lake, MN (US); Duane D. Fansler, Dresser, WI (US); Jonah Shaver, St. Paul, MN (US); John A. Wheatley, Stillwater, MN (US); Susannah C. Clear, Hastings, MN (US); Daniel J. Theis, Mahtomedi, MN (US); John T. Strand, Stillwater, MN (US); Thomas J. Metzler, St. Paul, MN (US); Kevin W. Gotrik, Hudson, WI (US); and Scott J. Jones, Woodbury, MN (US)
Assigned to 3M Innovative Properties Company, St. Paul, MN (US)
Appl. No. 17/261,983
Filed by 3M INNOVATIVE PROPERTIES COMPANY, St. Paul, MN (US)
PCT Filed Jul. 23, 2019, PCT No. PCT/IB2019/056302
§ 371(c)(1), (2) Date Jan. 21, 2021,
PCT Pub. No. WO2020/021459, PCT Pub. Date Jan. 30, 2020.
Claims priority of provisional application 62/702,672, filed on Jul. 24, 2018.
Prior Publication US 2022/0113457 A1, Apr. 14, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. G02B 5/26 (2006.01); G02B 5/124 (2006.01); G02B 5/20 (2006.01)
CPC G02B 5/26 (2013.01) [G02B 5/124 (2013.01); G02B 5/208 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A process for making a patterned wavelength-selective film comprising:
providing a substrate;
providing a wavelength-selective film;
applying adhesive in a pattern between the substrate and the wavelength-selective film;
breaking portions of the wavelength-selective film at the adhesive to form patterned portions of the wavelength-selective film on the substrate.